The 300mm silicon carbide wafer targets higher production capacity for power electronics and advanced system integration.

Device level SiC wafers require a systematic process including single crystal growth, wire cutting, lapping or grinding, and chemical mechanical polishing. SiC wafers have important application value ...

Device level SiC wafers require a systematic process including single crystal growth, wire cutting, lapping or grinding, and chemical mechanical polishing. SiC wafers have important application value ...

BAY CITY, Mich. (AP) — The U.S. Department of Energy announced a conditional $544 million loan Thursday that would allow a Michigan semiconductor manufacturing plant to expand to make parts that can ...

The industry's transition from 6-inch to 8-inch silicon carbide (SiC) wafers will face challenges, such as cost, in the short term, according to industry sources. Save my User ID and Password Some ...

BAY CITY, MI — Officials with the U.S. Department of Energy’s Loan Programs Office on Thursday, Feb. 22, announced a conditional commitment to Bay City’s SK Siltron CSS for a $544 million loan to ...

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

Renesas signing a 10-year supply agreement with Wolfspeed for silicon carbide (SiC) bare and epitaxial wafers is another stark reminder of an industry-wide transition from silicon to SiC semiconductor ...

innovative silicon carbide (SiC) wafer semiconductor manufacturer Pallidus will relocate its corporate headquarters and manufacturing operations to York County, SC. The company’s $443 million ...

SAN LUIS OBISPO, Calif., July 27, 2023 /PRNewswire/ -- This planned purchase, which will ship to Senic in Q4-2023, reinforces the 6EZ's position as the most flexible chemical mechanical polishing (CMP ...