Avicena is unveiling a modular interconnect platform with multi-Tbps/mm shoreline density based on its LightBundle™ microLED technology, supporting a wide range of die-to-die interfaces. SAN DIEGO — ...

DUBLIN--(BUSINESS WIRE)--The "Intel's Embedded Multi-Die Interconnect Bridge Complete Teardown Report" report has been added to ResearchAndMarkets.com's offering. In the last few years, as the central ...

Researchers developed a scalable interconnect that facilitates all-to-all communication among many quantum processor modules by enabling each to send and receive quantum information on demand in a ...

DENVER--(BUSINESS WIRE)--CoreSite Realty Corporation (NYSE:COR) (the “Company”), a premier provider of secure, reliable, high-uptime data center campuses with high-performance cloud access and ...