The SG25-BGA-2016 socket for a 2.76 x 2.76-mm, 0.35-mm-pitch wafer-level chip-scale package (WLCSP) operates at frequencies to 40 GHz with less than 1 dB of insertion loss (GSSG configuration).
As semiconductor devices continue to advance, the demand for reliable, high-performance test sockets has never been greater. Yet, traditional socket design validation methods—such as per-pin ...
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