Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology The Cadence Integrity ™ 3D-IC Platform now features enhanced support for improved ...

A chip smaller than one square millimeter stores 160 holographic images at arbitrary 3D coordinates, with each spatial ...

AMD has teased the launched of a new Ryzen processor with two chiplets, each of which will include a healthy dollop of 3D V-Cache.

Researchers at Stanford, MIT, and other universities unveiled a new, monolithic 3D processor that could help solve one of the biggest problems facing chipmakers: the processor-memory performance gap.

The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...

Artificial intelligence is colliding with a hard physical limit: the energy it takes to move data on and off chips. Training ...

Researchers used 3D printing and capillary action to create customizable neural chips, expanding design freedom for brain research, biosensors and biocomputing. (Nanowerk News) Cultured neural tissues ...

A new chip-based quantum memory uses nanoprinted “light cages” to trap light inside atomic vapor, enabling fast, reliable ...

A new chip-based quantum memory uses 3D-printed “light cages” to store light in atomic vapor with high precision. Quantum ...

Governments around the globe are starting to invest more heavily in chip design tools and related research as part of an effort to boost on-shore chip production, opening new opportunities for ...