Discover how heat resistant materials and material science innovations help electronics manufacturing manage rising temperatures, boost reliability, and enable smaller, more powerful next‑generation ...
Increasing electronic packaging density leads to a greater need for precise thermal management. Hence, for electrical ...
As three-dimensional integrated circuit (3D-IC) technology becomes the architectural backbone of AI, high-performance computing (HPC), and advanced edge systems, thermal management has shifted from a ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback